Gelid Solutions GP-Extreme 12W-Thermal Pad 120x120 Excellent Heat Conduction, Ideal Gap Filler. Easy Installation (120x120x2.0)
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- 🔩 HIGH-QUALITY MATERIALS & SUPERIOR PERFORMANCE 🔩 – The GELID SOLUTIONS GP-Extreme is made from high-performance materials that deliver excellent thermal conductivity with a rating of 12 W/mK, significantly improving heat dissipation efficiency for CPUs, GPUs, motherboards, and other electronic components.
- 💨 OPTIMIZED HEAT DISSIPATION FOR MAXIMUM EFFICIENCY 💨 – Thanks to its advanced composition, this thermal pad eliminates air gaps between components and heatsinks, enhancing heat transfer and preventing overheating. Ideal for gaming PCs, workstations, mining rigs, and other high-performance electronic devices.
- ⚙️ LARGE FORMAT & EASY TO CUSTOMIZE FOR ANY COMPONENT ⚙️ – Measuring 120 × 120 mm with a thickness of 2.0 mm, the GP-Extreme can be easily cut to fit virtually any contact surface. A versatile solution for CPUs, GPUs, heatsinks, RAM modules, motherboards, and much more.
- 🔧 EASY, CLEAN INSTALLATION – NO THERMAL PASTE REQUIRED 🔧 – Unlike traditional thermal paste, this thermal pad can be installed in seconds without any mess or additional tools. Simply place it between the component and the heatsink for fast, reliable cooling. The perfect choice for anyone looking for a practical, hassle-free solution.
- 🛡️ MAXIMUM SAFETY: NON-CONDUCTIVE, NON-CORROSIVE & LONG-LASTING 🛡️ – The GP-Extreme is completely electrically non-conductive, eliminating the risk of short circuits or damage to sensitive components. It is also silicone-free and non-corrosive, ensuring long-lasting durability and consistent thermal performance over time.
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Estimated shipping
Select a product to estimate shipping.High-Performance Thermal Pads for Efficient Heat Transfer
GELID GP-Extreme thermal pads provide up to 12 W/mK thermal conductivity , helping transfer heat from critical electronic components to heatsinks and cooling solutions. The soft, compressible material fills uneven gaps and improves surface contact, making it suitable for GPU and VGA cards, VRM modules, RAM, chipsets, SSDs, laptops, gaming consoles, PCBs and other electronic devices .
Easy to Cut, Safe to Use and Available in Multiple Sizes
Designed for convenient installation, GP-Extreme thermal pads can be cut to the required shape and positioned directly between the component and heatsink. The electrically insulating material is available in several sheet sizes and thicknesses from 0.5 mm to 3.0 mm , allowing users to select the correct fit for PC building, hardware upgrades, electronics repair and cooling maintenance.
Product details
| Main Specification | |
|---|---|
| Wytwórca | Gelid Solutions, Gelid Solutions Ltd. Unit 602, 6/F, Tower A, Southmark, 11 Yip Hing Street, Wong Chuk Hang. Aberdeen, Hong Kong |
| Liczba jednostek | 1, 0 |
| Pozycja Wymiary L x W x H | 12L x 12W x 0.2H Centimeters |
| Marka | Gelid Solutions |
| Liczba pozycji | 1 |
| Zawarte komponenty | Therma pad |
| Wymiary produktu | 12L x 12W x 0.2H Centimeters |
| Typ montażu | Instalacja PCB |
| Pozycja Waga | 0, 11 Kilogram |
| Product information | |
| Liczba opakowań | 1 |
| Technical Details | |
| Numer części | TP-GP01-S-D |
| Item details | |
| Numer modelu | TP-GP01-S-D |
| Nazwa typu elementu | THERMAL PAD |
| Others | |
| Informacje kontaktowe Packera | XPGX QUIRGO PRIVATE LIMITED NO 11 or DIAGONAL ROAD 3RD BLOCK or JAYANAGAR BANGALORE SOUTH JAYANGAR III BLOCK BANGALORE-560011 KARNATAKA |
| Importer Informacje kontaktowe | XPGX QUIRGO PRIVATE LIMITED NO 11 or DIAGONAL ROAD 3RD BLOCK or JAYANAGAR BANGALORE SOUTH JAYANGAR III BLOCK BANGALORE-560011 KARNATAKA |
| Typ produktu | THERMAL PAD |
| Producent Informacje kontaktowe | Gelid Solutions Ltd. Unit 602, 6/F, Tower A, Southmark, 11 Yip Hing Street, Wong Chuk Hang. Aberdeen, Hong Kong |
| Chłodziarka Materiał grzejnikowy | Aluminium |
| Kompatybilność grzejnika chłodniczego | compatible with various heat sinks |